GK Semi

Laser Products

GKCP-0808-300M-CW-01

808 nm Laser Chip

Quantum-well epitaxy · High slope efficiency | Enabling infrared night vision and precision sensing.

GKCP-0808-300M-CW-01 product photograph
Wavelength808 nm
Output300 mW
Operating modeCW
Spectral width2 nm
Pulse / dutyContinuous wave

01 / Product introduction

Product introduction

This 808 nm 300 mW laser chip uses advanced quantum-well epitaxy with a ridge-waveguide Fabry-Pérot cavity structure, giving high electro-optical conversion efficiency and long-life reliability. Supplied as a bare chip for customers who package in-house, it is well suited to consumer- and industrial-grade infrared sensing sources.

02 / Core application scenarios

Core application scenarios

01
Infrared night vision and illuminationInfrared fill light for security surveillance and night-vision systems.
02
Laser pumping sourcesPump sources for diode-pumped solid-state lasers (DPSSL) and miniature fiber lasers.
03
Consumer electronics and industrial sensingLaser ranging in robotic vacuums, LiDAR and industrial automation inspection.
04
Medical aesthetic equipmentPrecision infrared therapy and light sources for miniature medical instruments.

03 / Core advantages

Core advantages

01
High slope efficiencyA slope efficiency of 1.4 W/A delivers 300 mW output from a 0.3 A drive current, giving excellent electro-optical conversion.
02
Low drive, low heatA 50 mA threshold current and 1.8 V operating voltage keep power draw and self-heating low, extending system runtime.
03
Excellent beam performanceA narrow 2 nm spectral width with controlled divergence of 31° fast axis and 15° slow axis eases lens shaping and coupling.
04
Reliable and durableOptimised facet passivation and wafer processing give long service life and stable operation across 15–35 °C.

04 / Core technical specifications

Core technical specifications

Wavelength
808 nm
Output
300 mW
Operating mode
CW
Spectral width
2 nm
Pulse / duty
Continuous wave
Drive
0.3 A / 1.8 V
Thermal control
15–35 °C
Package
Bare laser chip
Output interface
Free-space / package dependent

04 / Project integration

Integration essentials

Drive
0.3 A / 1.8 V
Thermal control
15–35 °C
Package
Bare laser chip
Output interface
Free-space / package dependent